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Encoders optical sensors & arrays |
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Here you can find
some of our
standard photo-electrical sensors for shaft encoders, both with photodiodes or
phototransistors designed and manufactured in Micropto.
Main differences are between the optodevices for absolute encoders and the optodevices for
incremental encoders and not only. There's another page dedicated to special sensor and hybrid dices.
The main characteristics of the our (SMT) opto-sensors (both
phototransistors or photodiodes arrays) are the followings:
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MO - AFD06
(ceramic structure) MO - PFD06 (plastic structure) 6 chips silicon P/N photodiode - array photodiodes Chip size of each photodiode: 2,3 mm x 1,1 mm Active area of each photodiode: 1,89 mm^2 Package size: 11,4 mm x 10,4 mm Compatible with OPR2100, OL2100, KOM2100B, ... |
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MO -
AFTO4 (ceramic structure) MO - PFT04 (plastic structure) 4 chips silicon linear array NPN phototransistor Optical pitch: 0,60 mm Package size: 6 mm x 4,6 mm |
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MO - AFTO6L
(ceramic structure) MO - PFT06L (plastic structure) 6 chips silicon NPN phototransistor Optical pitch: 0,60 mm Package size: 6 mm x 5,8 mm |
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MO - AFTO6S
(ceramic structure) MO - PFT06S (plastic structure) 6 chips silicon linear array NPN phototransistor Optical pitch: 0,68 mm Package size: 7,5 mm x 6,6 mm |
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MO - AFT10L
(ceramic structure) MO - PFT10L (plastic structure) 10 chips silicon linear array NPN phototransistor Optical pitch: 0,60 mm Package size: 6 mm x 9,2 mm |
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MO - AFT10S
(ceramic structure) MO - PFT10S (plastic structure) 10 chips silicon linear array NPN phototransistor Optical pitch: 0,68 mm Package size: 6 mm x 9,2 mm |
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MO -
AFT13L (ceramic structure) MO - PFT13L (plastic structure) 13 chips silicon linear array NPN phototransistor Optical pitch: 0,60 mm Package size: 6 mm x 11,8 mm |
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*** Others models on request *** |
MO - AFT13S
(ceramic structure) MO - PFT13S (plastic structure) 13 chips silicon linear array NPN phototransistor Optical pitch: 0,68 mm Package size: 6 mm x 11,8 mm |
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The packages in this page are only few of the standard models. Many others kinds are available as standard or on customer specifics and specific characteristics by the customer but usually they are reserved projects and not to disclose. We are able to design and manufacture new silicon sensors and the electronics package (with or without electronics - hybrid) in every dimension and shape. Disk and reticles available. Pls. contact us for more info, availability and updates. |
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